Transient thermal cracking of a brittle half space medium with a semi-elliptical surface crack

The paper conducts the cracking study of a brittle half space medium with a semi-elliptical surface crack. The transient thermal stress intensity factors are obtained and are graphically presented. Effects of thermal shock time, crack size, and crack shape on the crack growth and thermal shock resistance behavior of the medium are investigated in details. A thermal shock resistance analysis methodology is established, allowing us to study the fracture strength of brittle media subjected to thermal shock.