Anti-plane crack intersecting the interface in a bonded smart structure with graded magnetoelectroelastic properties

The mechanical model is established for an anti-plane crack intersecting the interface in a bonded smart structure with graded magnetoelectroelastic properties. The purpose of the present work is to put forth a new treatment method for the fracture analysis of the interface-intersecting crack. Such a crack is equivalently divided into two special edge cracks in the two bonded strips, respectively. The problem is then formulated by Fourier integral transform and reduced into a system of singular integral equations, which are numerically solved under not only the classical single-valuedness conditions but also the continuity conditions of the two groups of auxiliary functions, and the latter is the key technique first introduced in the current work. The present treatment method is compared with the existing one in the literature. The numerical results of the energy density factor are provided to verify the validity of the present treatment and reveal the influences of the physical and geometrical parameters.