Effect of tungsten addition on thermal conductivity of graphite/copper composites

Graphite/copper composites with high thermal conductivity were fabricated by tungsten addition, which formed a thin tungsten carbide layer at the interface. The microstructure and thermal conductivity of the composite material were studied. The results indicated that the insertion of tungsten carbide layer obviously suppressed spheroidization of copper coating on the graphite particles during the sintering process, and decreased the interfacial thermal resistance of the composites. Compared with the graphite/copper composites without tungsten, the thermal conductivity of the obtained composites was increased by 43.6%.