کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
818323 | 1469438 | 2013 | 5 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
High performance polymer/AlN composites for electronic substrate application
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کلمات کلیدی
موضوعات مرتبط
مهندسی و علوم پایه
سایر رشته های مهندسی
مهندسی (عمومی)
پیش نمایش صفحه اول مقاله
چکیده انگلیسی
An ideal high performance poly(etheretherketone) (PEEK)/AlN composite that has unique combination of anisotropic linear coefficient of thermal expansion (CTE) and dielectric properties was developed for the use in electronic packaging substrate as an alternative of conventionally used epoxy/E-glass substrate. The out-of-plane and in-plane CTEs of the composites were very close to that of copper and silicon chip, respectively. The dielectric constants of the composites are almost independent with increasing frequency. The dissipation factor decreased approximately 50% compared to the pure PEEK. These results reveal that the composite may be the futuristic candidate for high performance electronic packaging substrate.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Composites Part B: Engineering - Volume 47, April 2013, Pages 70-74
Journal: Composites Part B: Engineering - Volume 47, April 2013, Pages 70-74
نویسندگان
R.K. Goyal, A.N. Tiwari, Y.S. Negi,