کد مقاله کد نشریه سال انتشار مقاله انگلیسی نسخه تمام متن
8184988 1527693 2018 81 صفحه PDF دانلود رایگان
عنوان انگلیسی مقاله ISI
Absence of ballistic charge transport in the half-filled 1D Hubbard model
موضوعات مرتبط
مهندسی و علوم پایه ریاضیات فیزیک ریاضی
پیش نمایش صفحه اول مقاله
Absence of ballistic charge transport in the half-filled 1D Hubbard model
چکیده انگلیسی
Whether in the thermodynamic limit of lattice length L→∞, hole concentration mηz=−2Sηz/L=1−ne→0, nonzero temperature T>0, and U/t>0 the charge stiffness of the 1D Hubbard model with first neighbor transfer integral t and on-site repulsion U is finite or vanishes and thus whether there is or there is no ballistic charge transport, respectively, remains an unsolved and controversial issue, as different approaches yield contradictory results. (Here Sηz=−(L−Ne)/2 is the η-spin projection and ne=Ne/L the electronic density.) In this paper we provide an upper bound on the charge stiffness and show that (similarly as at zero temperature), for T>0 and U/t>0 it vanishes for mηz→0 within the canonical ensemble in the thermodynamic limit L→∞. Moreover, we show that at high temperature T→∞ the charge stiffness vanishes as well within the grand-canonical ensemble for L→∞ and chemical potential μ→μu where (μ−μu)≥0 and 2μu is the Mott-Hubbard gap. The lack of charge ballistic transport indicates that charge transport at finite temperatures is dominated by a diffusive contribution. Our scheme uses a suitable exact representation of the electrons in terms of rotated electrons for which the numbers of singly occupied and doubly occupied lattice sites are good quantum numbers for U/t>0. In contrast to often less controllable numerical studies, the use of such a representation reveals the carriers that couple to the charge probes and provides useful physical information on the microscopic processes behind the exotic charge transport properties of the 1D electronic correlated system under study.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Nuclear Physics B - Volume 930, May 2018, Pages 418-498
نویسندگان
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