Deformation behavior of woven glass/epoxy composite substrate under thermo-mechanical loading

• Storage modulus significantly decreased at temperature above 138 °C.
• Deformation rate change resulted from state transition was noticeable.
• Residual displacement strongly depended on temperature history.

The deformation behaviors of woven glass/epoxy composite substrate under four thermo-mechanical loading paths, i.e. rectangular and triangular paths in clockwise and anticlockwise directions within a temperature range of 25–250 °C were investigated. Temperature scanning tests were conducted to identify the viscoelastic property of the material. The glass transition temperature of the composite substrate was 138 °C, above which significant reduction of storage modulus was observed. The deformation behavior of the composite substrate was temperature and history dependent, and change of deformation rate resulted from state transition was noticeable. The residual deformation of specimen following the anticlockwise rectangular loading path was the largest in contrast with the lowest in clockwise rectangular path. The residual deformations in two triangular paths were close after each cycle.

Figure optionsDownload as PowerPoint slide