Effects of TiN nanoparticles on the microstructure and properties of W–30Cu composites prepared via electroless plating and powder metallurgy

• TiN-doped W–Cu composite was successfully prepared by electroless plating and powder metallurgy.
• TiN-doped W–Cu significantly affected the microstructure and properties of the composites.
• W–Cu composite with 0.25 wt.% TiN possesses the best comprehensive performance.

W–30Cu/(0, 0.25, 0.5, 1, and 2) wt.% TiN composites were prepared via electroless plating with simplified pretreatment and powder metallurgy. The phase and morphology of W–Cu/TiN composite powders and sintered W–Cu/TiN samples were characterized via X-ray diffraction and field emission scanning electron microscopy. Transmission electron microscopy was performed to characterize the microstructure of the sintered W–Cu/TiN samples. The relative density, hardness, electrical conductivity, and compressive strength of the sintered samples were examined. Results showed that W–30Cu composite powders with a uniform structure can be obtained using W powder pretreated with nitric acid, ammonium fluoride, and hydrofluoric acid followed by electroless Cu plating. The addition of TiN nanoparticles significantly affected the microstructure and properties of the W–30Cu composites. A good combination of the compressive strength and hardness of the W–30Cu composite material can be obtained by incorporating the TiN additive at 0.25 wt.%. However, the relative density and electrical conductivity slightly decreased.

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