Bond strength optimization of Ti/Cu/Ti clad composites produced by roll-bonding

• Ti/Cu/Ti clad composite was successfully fabricated by the roll-bonding technique.
• The most effective bonding parameter was post-annealing temperature.
• The mechanism of the Cu/Ti roll bonding could be clarified using the film theory.

This research focuses on the bond strength of the Ti/Cu/Ti composites fabricated by roll-bonding. The peel tests were used to evaluate the bond strength of the clad composites. The Taguchi technique was used to find the optimum conditions to maximize the Cu/Ti bond strength. The optical microscopy, scanning electron microscopy, energy dispersive X-ray spectroscopy, as well as peel and microhardness tests were utilized to characterize the interfacial zones. A Taguchi L32 orthogonal array was selected to study the influence of the roll-bonding parameters, including the roller lubrication conditions, temper condition of Cu, rolling temperature, reduction in thickness, post-annealing time, and post-annealing temperature, and rolling speed on the bond strength. Based on the Taguchi statistical analysis, the rolling temperature, reduction in thickness, post-annealing temperature and rolling speed have significant effects on the bond strength. Among these, the post-annealing temperature is the most effective factor. It was shown that the selection of the highest “reduction in thickness”, the lowest “rolling speed”, and the intermediate values of “rolling temperature” and “post-annealing temperature” leads to the highest bond strength. It was also indicated that the mechanism of the Cu/Ti roll bonding could be explained using the film theory.

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