کد مقاله کد نشریه سال انتشار مقاله انگلیسی نسخه تمام متن
829391 1470340 2014 6 صفحه PDF دانلود رایگان
عنوان انگلیسی مقاله ISI
Properties enhancement of SnAgCu solders containing rare earth Yb
موضوعات مرتبط
مهندسی و علوم پایه سایر رشته های مهندسی مهندسی (عمومی)
پیش نمایش صفحه اول مقاله
Properties enhancement of SnAgCu solders containing rare earth Yb
چکیده انگلیسی


• New lead-free solders were designed with different Yb.
• The enhancement of properties of solders were analyzed.
• Rare earth Yb can refine the microstructure of solders.

In order to enhance the properties of SnAgCu lead-free solders in microelectronic packaging, various contents of rare earth Yb were incorporated into the alloys. Results indicated that the addition of Yb can improve the wettability, tensile strength, thermal fatigue behavior of lead-free alloys. The lead-free solder with 0.05%Yb addition exhibited the best comprehensive properties as compared to the alloys with other Yb weight fractions. And found that after soldering, the initial interfacial IMC thickness of SnAgCuYb solder joint was smaller than that of SnAgCu solder joints, and this signified that the addition of Yb was effective in retarding the growth of the IMC layer. In addition, the Yb can refine the microstructures of SnAgCu solder, excessive Yb added can form bulk Sn–Yb phase and deteriorate the properties.

ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Materials & Design - Volume 57, May 2014, Pages 646–651
نویسندگان
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