Bonding W and W–Cu composite with an amorphous W–Fe coated copper foil through hot pressing method

A new method to bond W and W–Cu composite was developed. W and W–Cu composite were bonded by hot pressing method with an amorphous W–Fe coated copper foil as the interlayer. Effects of the interlayer on the microstructure and thermal conductivity of the bonded specimen were investigated. The results showed that bonding quality was improved by using the interlayer. First, metallurgical bonding between W and W–Cu composite was obtained owing to the diffusion of Fe and the crystallization of amorphous W in the coating of the interlayer. Furthermore, both the thermal conductivity and relative thermal conductivity of the bonded specimen were increased because of the malleability of the interlayer.

► W–Fe coated copper foil is firstly used to bond W and W–Cu composite.
► Metallurgical bonding is obtained by using the interlayer.
► The improvement above is due to grain growth of amorphous W and the diffusion of Fe.
► Higher thermal conductivity and relative thermal conductivity are obtained.