Study of deformation and aging behaviors of a hot rolled–quenched Cu–Cr–Zr–Mg–Si alloy during thermomechanical treatments

The deformation and aging behaviors of a hot rolled–quenched Cu–Cr–Zr–Mg–Si alloy were investigated by microhardness and electrical resistivity measurements, and transmission electron microscopy observations. The resistivity of aged alloy increases almost linearly with increasing of the secondary cold deformation reductions, and a faster and larger increase in resistivity of the peak-aged alloy is found during the deformation process due to the occurrence of resolution phenomenon. Quantitative analysis shows that about 0.0385 wt.% solutes are re-dissolved into the peak-aged alloy after 70% cold deformation. Results of the following aging treatment show that the deterioration caused by resolution phenomenon in electrical properties can be eliminated by the secondary aging treatment. A good combination of high hardness and low resistivity can be achieved in the Cu–Cr–Zr–Mg–Si alloy after suitable thermomechanical treatments.

► The deformation and aging behaviors of a Cu–Cr–Zr–Mg–Si alloy were investigated.
► A faster and larger increase in resistivity is found during deformation for the peak-aged alloy.
► The abnormal increase in resistivity is ascribed to the occurrence of resolution phenomenon.
► About 0.0385 wt.% solutes are re-dissolved into the alloy after 70% deformation.
► Deterioration of resolution in electrical properties can be eliminated by the secondary aging.