Transient liquid phase diffusion bonding of Al/Mg2Si metal matrix composite

As-cast Al/Mg2Si metal matrix composite was joined by transient liquid phase diffusion bonding using Cu interlayer at various bonding temperatures and durations. This metal matrix composite contained 15% Mg2Si and was produced through in situ technique by gravity casting. Specific diffusion bonding process was applied as a low vacuum technique. The microstructure of joints consisted of Al-α, CuAl2 and Mg2Si or Al-α and Mg2Si depending on bonding temperature and duration. The maximum shear strength was achieved when samples were bonded at 580 °C for 120 min. Micro-hardness and compositional homogeneity of joints across the bonded interface were improved with increasing the bonding duration at 560 °C and had no significant changes at 580 °C.

Research highlights
► Evaluation of TLP feasibility for joining of Al/Mg2Si MMC using Cu interlayer.
► Evaluation of bonding temperature and duration effects.
► Evaluation of TLP process under low vacuum.
► Evaluation of TLP diffusion bonding in cast MMCs with porosity.