کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
832562 | 908122 | 2009 | 8 صفحه PDF | دانلود رایگان |
Accumulative roll-bonding process is a severe plastic deformation process capable of developing grains below 1 μm in diameter. In this study, microstructure, mechanical properties and electrical conductivity of commercial pure copper strips processed by accumulative roll-bonding were investigated. Transmission electron microscopic micrographs of the strips produced by eight cycles of accumulative roll-bonding process showed ultra-fine grains ∼180 nm in size with high angle grain boundaries. Also tensile strength and microhardness of the accumulative roll-bonding processed samples increased with increasing the number of accumulative roll-bonding cycles. Whereas, the elongation dropped abruptly at the first cycles, above which it increased slightly. The electrical conductivity decreased with increasing accumulative roll-bonding cycles up to 6 cycles and then increased up to 8 cycles of accumulative roll-bonding process.
Journal: Materials & Design - Volume 30, Issue 8, September 2009, Pages 2911–2918