کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
865923 | 909688 | 2007 | 6 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
Influence of Temperature on Creep Behavior of Ag Particle Enhancement SnCu Based Composite Solder
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موضوعات مرتبط
مهندسی و علوم پایه
سایر رشته های مهندسی
مهندسی (عمومی)
پیش نمایش صفحه اول مقاله
![عکس صفحه اول مقاله: Influence of Temperature on Creep Behavior of Ag Particle Enhancement SnCu Based Composite Solder Influence of Temperature on Creep Behavior of Ag Particle Enhancement SnCu Based Composite Solder](/preview/png/865923.png)
چکیده انگلیسی
The creep properties of solder alloys are an important factor affecting the reliability of soldered joints in surface mount technologies. Particle-enhancement is one way to improve the properties of solder alloys. The temperature of the solder joint is one of the primary factors affecting the solder joint creep properties. Single shear lap creep specimens with a 1 mm2 cross-sectional area were fabricated using Ag particle enhancement 99.3Sn0.7Cu based composite solder and 99.3Sn0.7Cu eutectic solder to examine the influence of temperature on the creep behavior of solder joints. The results show that the solder joint creep resistance of the composite solder joint was generally superior to that of the 99.3Sn0.7Cu solder joint. The creep rupture life of the composite solder joint was reduced by increasing temperatures at a faster rate than that of the 99.3Sn0.7Cu eutectic solder joint.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Tsinghua Science & Technology - Volume 12, Issue 3, June 2007, Pages 296-301
Journal: Tsinghua Science & Technology - Volume 12, Issue 3, June 2007, Pages 296-301
نویسندگان
Yan (é«çæ), Feng (å¯ä¸½è³), Zhang (å¼ æ¯æ¯), Wen (æä¹å·´),