Temperature distributions in a copper and aluminium layered base of a CrNi-steel saucepan

In this study, the main objective is to find a numerical solution to the problem of non-regular distribution of temperature on the “non-heated” side of an irregularly-heated plate by means of placing two layers of Cu/CrNi and Al/CrNi of varying thicknesses in a combined structure. For this aim, the Finite-Element Method program package ANSYS has been used. The Al/CrNi laminated plate has a low temperature-gradient distribution on its upper (or “non-heated”) surface due to its low heat conductivity compared with that of the Cu/CrNi steel.