کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
9691055 | 1457517 | 2005 | 9 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
Effect of protrusion on thermal transient behavior of chips in a liquid channel during loss of pumping power
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کلمات کلیدی
موضوعات مرتبط
مهندسی و علوم پایه
مهندسی شیمی
جریان سیال و فرایندهای انتقال
پیش نمایش صفحه اول مقاله
چکیده انگلیسی
Experiments are performed to study the single-phase transient heat transfer at different protrusion heights of the electronic chips during an accidental stoppage of coolant flow due to loss of pumping power. Water is the coolant media and the flow covers the wide range of laminar flow regime with Reynolds number, based on heat source length, from 800 to 2625 and the heat flux ranging from 1 W/cm2 to 7 W/cm2. The general impacts of heat source protrusions (B=1, 2 mm) on heat transfer behavior of four chips are investigated by comparing the results obtained from flush-mounted (B=0) heat sources. Finally the correlation equations are obtained by modifying the correlations of flush-mounted heater, employing the chips' protrusion height (B) in the dimensionless (B/â) form.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: International Communications in Heat and Mass Transfer - Volume 32, Issues 1â2, January 2005, Pages 166-174
Journal: International Communications in Heat and Mass Transfer - Volume 32, Issues 1â2, January 2005, Pages 166-174
نویسندگان
H. Bhowmik, K.W. Tou,