Performances of thermoelectric cooler integrated with microchannel heat sinks

In this study, experimental and theoretical studies on thermoelectric cooler (TEC) performance for cooling a refrigerated object (water in a tank) were performed. Microchannel heat sinks fabricated with etched silicon wafers were employed on the TEC hot side to dissipate heat. The measurements show that the temperature of the refrigerated object decreased with time. A theoretical model based on a lumped system was established to predict the transient behavior of the variation in temperature for the refrigerated object with time. The theoretical predicted temperature variation was in good agreement with the measured data. The relationship among the heat sink thermal resistances, TEC electric current input and minimum refrigerated objected temperature was examined based on the theoretical model. The calculated minimum temperatures were showed for the several cases of heat sink thermal resistance on the TEC hot side and electric current input. The minimum temperature can be obtained by increasing the electrical current input and decreasing the heat sink thermal resistance.