Investigations of transient thermal properties of conductively cooled diode laser arrays operating under quasicontinuous-wave conditions Fulltext Access 6 Pages 2006
A conservative shock filter model for the numerical approximation of conservation laws Fulltext Access 6 Pages 2006
Existence of extremal solutions for discontinuous functional integral equations Fulltext Access 6 Pages 2006
Reliability of Pb(Mg,Nb)O3–Pb(Zr,Ti)O3 multilayer ceramic piezoelectric actuators by Weibull method Fulltext Access 6 Pages 2006
Distributed collaborative design of IP components in the TRMS environment Fulltext Access 6 Pages 2006
Life margin assessment with Physics of Failure Tools application to BGA packages Fulltext Access 6 Pages 2006
Nano-mechanical electro-thermal probe array used for high-density storage based on NEMS technology Fulltext Access 6 Pages 2006
Investigation of the influence of thermal treatment on interconnect-barrier interfaces in copper metallization systems Fulltext Access 6 Pages 2006
Geometric and approximation properties of a complex Post–Widder operator in the unit disk Fulltext Access 6 Pages 2006
Minimizing hydrogen content in silicon oxynitride by thermal oxidation of silicon-rich silicon nitride Fulltext Access 6 Pages 2006
Current-dependent hot-electron stresses on InGaP-gated and AlGaAs-gated low noise PHEMTs Fulltext Access 6 Pages 2006
Dynamic hot-carrier induced degradation in n-channel polysilicon thin-film transistors Fulltext Access 6 Pages 2006
Optimizing the controller IC for micro HDD process based on Taguchi methods Fulltext Access 6 Pages 2006
Degradation by Sn diffusion applied to surface mounting with Ag-epoxy conductive adhesive with joining pressure Fulltext Access 6 Pages 2006
Test structure assembly for bump bond yield measurement on high density flip chip technologies Fulltext Access 6 Pages 2006
Study of dc conduction mechanisms in dysprosium–manganese oxide insulator thin films grown on Si substrates Fulltext Access 6 Pages 2006
Wear out failure mechanisms in aluminium and gold based LDMOS RF power applications Fulltext Access 6 Pages 2006
Dressing procedure for some homoclinic connections of the Manakov system Fulltext Access 6 Pages 2006
On the concave and convex solutions of a mixed convection boundary layer approximation in a porous medium Fulltext Access 6 Pages 2006
Multiple solutions of mixed convection boundary-layer approximations in a porous medium Fulltext Access 6 Pages 2006
Periodic solutions for discrete predator–prey systems with the Beddington–DeAngelis functional response Fulltext Access 6 Pages 2006
A comparison principle for nonlocal coupled systems of fully nonlinear parabolic equations Fulltext Access 6 Pages 2006
Global exponential stability of interval neural networks with variable delays Fulltext Access 6 Pages 2006
About stability of a difference analogue of a nonlinear integro-differential equation of convolution type Fulltext Access 6 Pages 2006
Structural reliability assessment of multi-stack package (MSP) under high temperature storage (HTS) testing condition Fulltext Access 6 Pages 2006
On weak and strong solutions of FF-implicit generalized variational inequalities with applications Fulltext Access 6 Pages 2006
The equivalence of upper semi-continuity of the solution map and the R0-condition in the mixed linear complementarity problem Fulltext Access 6 Pages 2006
Further analysis on complete stability of cellular neural networks with delay Fulltext Access 6 Pages 2006
The motion of a viscous filament in a porous medium or Hele–Shaw cell: a physical realisation of the Cauchy–Riemann equations Fulltext Access 6 Pages 2006
A note on the number of nodal solutions of an elliptic equation with symmetry Fulltext Access 6 Pages 2006
Linearized oscillation in a nonautonomous scalar delay differential equation Fulltext Access 6 Pages 2006
ATPG scan logic failure analysis: a case study of logic ICs – fault isolation, defect mechanism identification and yield improvement Fulltext Access 6 Pages 2006
Analysis of ESD failure mechanism in 65nm bulk CMOS ESD NMOSFETs with ESD implant Fulltext Access 6 Pages 2006
Analysis of triggering behaviour of high voltage CMOS LDMOS clamps and SCRs during ESD induced latch-up Fulltext Access 6 Pages 2006
Electromigration failure distributions of dual damascene Cu /low – k interconnects Fulltext Access 6 Pages 2006
Fault diagnosis technology based on transistor behavior analysis for physical analysis Fulltext Access 6 Pages 2006
Characterization of photonic devices by secondary electron potential contrast Fulltext Access 6 Pages 2006
Electron BackScattered Diffraction (EBSD) use and applications in newest technologies development Fulltext Access 6 Pages 2006
Time resolved imaging using synchronous picosecond Photoelectric Laser Stimulation Fulltext Access 6 Pages 2006
Reduced temperature dependence of hot carrier degradation in deuterated nMOSFETs Fulltext Access 6 Pages 2006
Part average analysis – A tool for reducing failure rates in automotive electronics Fulltext Access 6 Pages 2006
Electromigration lifetimes and void growth at low cumulative failure probability Fulltext Access 6 Pages 2006
Experimental studies of board-level reliability of chip-scale packages subjected to JEDEC drop test condition Fulltext Access 6 Pages 2006
Thermal performance impacts of heat spreading lids on flip chip packages: With and without heat sinks Fulltext Access 6 Pages 2006
Effects of hot carriers in offset gated polysilicon thin-film transistors Fulltext Access 6 Pages 2006
Simplified quantitative stress-induced leakage current (SILC) model for MOS devices Fulltext Access 6 Pages 2006
The periodic character of positive solutions of the difference equation χn+1 = (χn, χn−k) Fulltext Access 6 Pages 2006
Effect of a buffer layer in the epi-substrate region to boost the avalanche capability of a 100V Schottky diode Fulltext Access 6 Pages 2006
Electromigration degradation mechanism for Pb-free flip-chip micro solder bumps Fulltext Access 6 Pages 2006
Improved physical understanding of intermittent failure in continuous monitoring method Fulltext Access 6 Pages 2006
The solder on rubber (SOR) interconnection design and its reliability assessment based on shear strength test and finite element analysis Fulltext Access 6 Pages 2006
Temperature measurement on series resistance and devices in power packs based on on-state voltage drop monitoring at high current Fulltext Access 6 Pages 2006
NBT stress-induced degradation and lifetime estimation in p-channel power VDMOSFETs Fulltext Access 6 Pages 2006
Electrical parameters degradation of power RF LDMOS device after accelerated ageing tests Fulltext Access 6 Pages 2006
New technique for the measurement of the static and of the transient junction temperature in IGBT devices under operating conditions Fulltext Access 6 Pages 2006
Effects of metallization thickness of ceramic substrates on the reliability of power assemblies under high temperature cycling Fulltext Access 6 Pages 2006
Thermal characterization and modeling of power hybrid converters for distributed power systems Fulltext Access 6 Pages 2006
Compact modelling and analysis of power-sharing unbalances in IGBT-modules used in traction applications Fulltext Access 6 Pages 2006
AlGaN/GaN HEMT Reliability Assessment by means of Low Frequency Noise Measurements Fulltext Access 6 Pages 2006
Delamination analysis of Cu/low-k technology subjected to chemical-mechanical polishing process conditions Fulltext Access 6 Pages 2006
A study of Cu/Low-k stress-induced voiding at via bottom and its microstructure effect Fulltext Access 6 Pages 2006