Keywords: Dielectrophoresis; Microfluidics; Electrokinetics; MEMSDEP, dielectrophoresis; PCB, printed circuit board; PDMS, polydimethylsiloxane; CNC, computer numerical control
مقالات ISI (ترجمه نشده)
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در صورتی که به ترجمه آماده هر یک از مقالات زیر نیاز داشته باشید، می توانید سفارش دهید تا مترجمان با تجربه این مجموعه در اسرع وقت آن را برای شما ترجمه نمایند.
Keywords: ELM, emulsion liquid membrane; PCB, printed circuit board; DPP, direct plating process; WC, tungsten mono-carbide; WHO, World Health Organization; USEPA, United States Environmental Protection Agency; PPM, parts-per millions; SPAN 80, surfactant, sorbitan
Keywords: AC, Alternating Current; CH, Channel; DACS, Data acquisition and control system; DC, Direct current; FPGA, Field Programmable Gate Array; IC, Integrated Circuit; IO, Input–output; PA, Photoacoustic; PCB, Printed Circuit Board; PI, Proportional–integral; P
Keywords: EWA, electronic-waste-based adsorbent; PCB, printed circuit board; PEG, polyethylene glycol; MF, metallic fraction; NMF, non-metallic fractionPellets; Compaction; Aluminosilicate-based material; E-waste; Adsorbent
Keywords: SEM, surfactant emulsion membrane; PCB, printed circuit board; DPP, direct plating process; WHO, World Health Organization; USEPA, United States Environmental Protection Agency; PPM, parts-per millions; SPAN 80, surfactant, sorbitan monooleate; TOC, total
Ultra-sensitive nucleic acids detection with electrical nanosensors based on CMOS-compatible silicon nanowire field-effect transistors
Keywords: SiNWs, silicon nanowires; SiNW-FETs, silicon nanowire field-effect transistors; CMOS, complementary metal oxide semiconductor; CVD, chemical vapor deposition; PECVD, plasma enhanced chemical vapor deposition; PCB, printed circuit board; SOI, silicon-on-in
On the electrochemical migration mechanism of tin in electronics
Keywords: ECM, electrochemical migration; PCB, printed circuit board; PCBA, printed circuit board assembly; SMD, surface mounted device; di, de-ionized; sir, surface insulation resistanceA. Tin; B. Potentiostatic; C. Electrochemical migration; C. Dendrite
Pulse and pulse reverse plating—Conceptual, advantages and applications
Keywords: TON, Pulse ON-time (ms); TOFF, Pulse OFF-time (ms); IP, Pulse peak current density (A dm−2); PC, Pulse current; PED, Pulse electrodeposition; PRC, Pulse reverse current; DC, Direct current; PCB, Printed circuit board; γ, Duty cycle; f, Frequency; T, Cycle