
Suppressing effect of 0.5 wt.% nano-TiO2 addition into Sn–3.5Ag–0.5Cu solder alloy on the intermetallic growth with Cu substrate during isothermal aging
Keywords: نانوذرات TiO2; Composite solder; Sn3.5Ag0.5Cu; TiO2 nanoparticles; Isothermal aging