
Design, fabrication and testing of wafer-level thin film vacuum packages for MEMS based on nanoporous alumina membranes
Keywords: بسته بندی خلاء; Wafer-level packaging; Vacuum encapsulation; Thin film surface micromachining technology; Porous anodic alumina; MEMS; Coplanar waveguides; Hermeticity; Package reliability; Epoxy overmolding