Constructing a yield model for integrated circuits based on a novel fuzzy variable of clustered defect pattern

► This study is to develop a new FVCP to recognize defect patterns, and predict the wafer yield by ACO-BPNN. ► The proposed FVCP is helpful in improving the accuracy of the wafer yield model. ► The proposed model can help the IC manufacturers to evaluate their process capability in relation to profit and loss.