کد مقاله کد نشریه سال انتشار مقاله انگلیسی نسخه تمام متن
10327449 681073 2005 17 صفحه PDF دانلود رایگان
عنوان انگلیسی مقاله ISI
Chips on wafers, or packing rectangles into grids
موضوعات مرتبط
مهندسی و علوم پایه مهندسی کامپیوتر نظریه محاسباتی و ریاضیات
پیش نمایش صفحه اول مقاله
Chips on wafers, or packing rectangles into grids
چکیده انگلیسی
A set of rectangles S is said to be grid packed if there exists a rectangular grid (not necessarily regular) such that every rectangle lies in the grid and there is at most one rectangle of S in each cell. The area of a grid packing is the area of a minimal bounding box that contains all the rectangles in the grid packing. We present an approximation algorithm that given a set S of rectangles and a real constant ɛ>0 produces a grid packing of S whose area is at most (1+ɛ) times larger than an optimal grid packing in polynomial time. If ɛ is chosen large enough the running time of the algorithm will be linear. We also study several interesting variants, for example the smallest area grid packing containing at least k⩽n rectangles, and given a region A grid pack as many rectangles as possible within A. Apart from the approximation algorithms we present several hardness results.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Computational Geometry - Volume 30, Issue 2, February 2005, Pages 95-111
نویسندگان
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