Degradation of high power single emitter laser modules using nanosilver paste in continuous pulse conditions

This paper is mainly reported to a pulse reliability investigation of high power single emitter laser modules with nanosilver paste. Comparative experiments in continuous pulse conditions for the laser modules packaged with nanosilver paste, indium and AuSn solders were conducted. The results indicate that the laser modules attached by nanosilver paste have a longer-term lifetime than those with indium and AuSn solders in continuous pulse conditions. Transient thermal behavior and coupled thermo-mechanical behavior in continuous pulse conditions are simulated by finite element method (FEM). A semi-empirical model based on Arrhenius relationship is established to provide relative reliability assessments for laser modules by combining with the simulating results.