کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
10364730 | 871787 | 2015 | 7 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
Interfacial reaction and mechanical evaluation in multi-level assembly joints with ENEPIG under bump metallization via drop and high speed impact test
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موضوعات مرتبط
مهندسی و علوم پایه
مهندسی کامپیوتر
سخت افزارها و معماری
پیش نمایش صفحه اول مقاله
چکیده انگلیسی
The criteria of mechanical reliability in solder joints can be identified and described by comparative evaluation via drop test and high speed pendulum impact test. Systematic samples of assembly and attachment joints with various Pd additions were employed and investigated in this study. The statistical values of mechanical performances were calculated and compared. Better high speed impact performance of SAC305/ENEPIG attachment joints with 0.06 μm Pd layers was confirmed owing to the single Cu6Sn5 phase growth. However, the comparative measurement of the better performance on drop testing exhibited in ENEPIG/SAC305/immersion Sn assembly joints with 0.1 μm Pd layers deposit resulted from the thinner and layer-type IMC growth. The correlation between the cracks propagation and Pd addition was established on the basis of the elemental X-ray color mapping via Field-Emission Electron Probe Microanalyzer (FE-EPMA). It is expected that through comparison between impact and drop test in mechanical reliability, a criterion of joints reliability can be established. Besides, the optimal Pd layer deposit for the ENEPIG surface finish in the attachment and assembly solder joints was demonstrated and confirmed.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Microelectronics Reliability - Volume 55, Issue 1, January 2015, Pages 231-237
Journal: Microelectronics Reliability - Volume 55, Issue 1, January 2015, Pages 231-237
نویسندگان
Hsiu-Min Lin, Cheng-Ying Ho, Wen-Lin Chen, Yi-Hsin Wu, De-Hui Wang, Jun-Ren Lin, Yu-Hui Wu, Huei-Cheng Hong, Zhi-Wei Lin, Jenq-Gong Duh,