Metal defect yield and reliability relationships

This is a paper that attempts to bridge the gap between quality and reliability using a particular physical structure and voltage stress methodology applied to metal interconnects and contacts. The study is focused specifically on early life failures-the ones that customers actually experience. Progress on characterization of this type of failure is necessary to improve reliability on any maturing process. This work supports the notion that quality is an integral part of device reliability. This work advances the knowledge of reliability by showing the importance of the relationship between quality and reliability to draw the focus towards what really matters for customers.