کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
10364973 | 871892 | 2005 | 6 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
Evaluation of compatibility of thick-film PTC thermistors and LTCC structures
دانلود مقاله + سفارش ترجمه
دانلود مقاله ISI انگلیسی
رایگان برای ایرانیان
موضوعات مرتبط
مهندسی و علوم پایه
مهندسی کامپیوتر
سخت افزارها و معماری
پیش نمایش صفحه اول مقاله

چکیده انگلیسی
The electrical and microstructural characteristics of 1 kΩ/sq. thick-film thermistors with high positive temperature coefficients of resistivity, i.e. PTC 5093 (Du Pont) fired either on “green” LTCC (low temperature cofired ceramics) substrates or buried within LTCC structures, were evaluated. The active phase (ruthenium oxide) in the PTC thermistors is not present in the dried films but is formed during firing due to the decomposition of the ruthenate phase. Because of interactions between a glassy LTCC material and thermistors electrical characteristic, i.e. sheet resistivities and noise indices of thermistors fired on the surface LTCC substrates, changed from values obtained on alumina substrates. The differences in the measured electrical parameters were attributed to the interactions between the thermistor layers and the glassy LTCC substrates. The inter-diffusion of oxides, mainly PbO and Al2O3, was confirmed by microanalysis. In the case of buried thermistors, presumably due to the incompatibility of both materials, the structure de-laminated during firing. Cracks between the buried PTC films and the LTCC substrates as well as cracks in PTC films resulted in high sheet resistivities and high noise indices.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Microelectronics Reliability - Volume 45, Issue 12, December 2005, Pages 1924-1929
Journal: Microelectronics Reliability - Volume 45, Issue 12, December 2005, Pages 1924-1929
نویسندگان
Darko BelaviÄ, Marko Hrovat, Jaroslaw Kita, Janez Holc, Jena CilenÅ¡ek, Leszek Golonka, Andrzej Dziedzic,