Transient analysis of the impact stage of wirebonding on Cu/low-K wafers

In this paper, transient mechanical responses of the Cu/low-K structure during the impact stage of the wirebonding process were investigated. Parametric studies were carried out to examine the effect of elastic moduli of different constituent materials on the potential of structural defect on the copper via and the pad. The analysis applied the explicit time integration scheme, which is feasible in dealing with the nonlinear transient structural behavior.