کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
10419178 | 903475 | 2005 | 8 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
SMT solder joint's semi-experimental fatigue model
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کلمات کلیدی
موضوعات مرتبط
مهندسی و علوم پایه
سایر رشته های مهندسی
مهندسی مکانیک
پیش نمایش صفحه اول مقاله
چکیده انگلیسی
The low-cycle fatigue induced by thermal cycling is the major concern in the reliability of surface mounted technology (SMT) for electronic packaging; however, dynamic loading effects to solder joint fatigue life have not been thoroughly investigated. In fact, the high-cycling fatigue induced by vibration can also contribute a significant effect. In certain circumstances it can become the dominant failure case when semiconductor devices are used in a vibration environment. In this paper, according to random vibration theory, a random fatigue semi-experimental model of SMT solder joint in random vibration condition is created and a series of vibration fatigue experimental vehicles including PBGA256 assembly were conducted. Compared with random vibration test results, its results are good enough to predict solder joints' fatigue.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Mechanics Research Communications - Volume 32, Issue 3, MayâJune 2005, Pages 351-358
Journal: Mechanics Research Communications - Volume 32, Issue 3, MayâJune 2005, Pages 351-358
نویسندگان
Qiang Guo, Mei Zhao, HongFang Wang,