The effect of introducing increased-reliability-risk electronic components into 3rd generation telecommunications systems

The paper consists of three parts: First, the reliability data of four electronic components is considered. This includes statistical analysis of the reliability test data, thermo-mechanical finite element analysis of the printed wiring board structures, and based on those, a field reliability estimate of the components is constructed. Second, the component level reliability data is introduced into the network element reliability analysis. This is accomplished by using a reliability block diagram technique and Monte Carlo simulation of the network element. The end result of the second part is a reliability estimate of the network element with and without the high-risk component. Third, the whole 3rd generation network having multiple network elements is analyzed. In this part, the criticality of introducing high-risk electronic components into a 3rd generation telecommunications network is considered.