Multiwalled carbon nanotubes as a contributing reinforcement phase for the improvement of thermal conductivity in copper matrix composites

The thermal conductivities of carbon nanotube (CNT)-copper (Cu) composites are greatly increased for compositions containing up to 1 vol.% CNT and remain above the value for pure Cu up to 3 vol.% CNT. The obtained enhancement was in good agreement with estimates based on Eshelby's equivalent inclusion method. This agreement suggests that very low thermal resistance might be realized at the interface between CNTs and the Cu matrix, which consists of faceted and closely attached interface without any compounds.