کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
10644560 | 999644 | 2005 | 9 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
Studies on nanoimprint process parameters of copper by molecular dynamics analysis
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موضوعات مرتبط
مهندسی و علوم پایه
سایر رشته های مهندسی
مکانیک محاسباتی
پیش نمایش صفحه اول مقاله
چکیده انگلیسی
If the environment temperature is higher, then the needed punching force becomes smaller. When increasing punch velocity, the needed punching force also increases. The internal energy of specimen under high temperature is smaller than that of low temperature. When increasing punch velocity, due to shorter relaxation time in the specimen, the absorbed energy will increase rapidly, and finally if it reaches the marginal value the specimen collapses. The spring back effect is an important factor to discuss. Since the imprinting energy is absorbed mainly by those atoms close to the punch, especially at both sides of punch, if as the punch leaves the specimen, the spring back phenomena of deformed-atomic structures in horizontal direction are more serious than in vertical direction.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Computational Materials Science - Volume 34, Issue 4, December 2005, Pages 314-322
Journal: Computational Materials Science - Volume 34, Issue 4, December 2005, Pages 314-322
نویسندگان
Q.C. Hsu, C.D. Wu, T.H. Fang,