In situ observations on shear and creep-fatigue fracture behaviors of SnBi/Cu solder joints

▶ Creep deformation mechanisms of the Sn-58Bi/Cu solder joints are investigated. ▶ In situ observation by SEM is employed for experiments. ▶ The strain of the solder joints increase exponentially with increasing cycles. ▶ Grain-boundary sliding is the major creep deformation mechanism of SnBi solder.