Shear deformation behavior of a Sn-3Ag-0.5Cu single solder ball at intermediate strain rates

▶ A miniature single solder ball joint was designed to mimic the actual solder joints. ▶ The strain rates determined using the miniature single solder joints are consistent with those from shear creep and dynamic compression tests. ▶ The unloading shear fracture toughness is generally consistent with the amount of bulk solder fracture on the fractured surface.