کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
10673129 | 1010222 | 2012 | 4 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
Crystallographic effect on subsurface damage formation in silicon microcutting
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موضوعات مرتبط
مهندسی و علوم پایه
سایر رشته های مهندسی
مهندسی صنعتی و تولید
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چکیده انگلیسی
Nanoprecision plunge cutting tests were carried out on single-crystal silicon (0 0 1) samples along various directions at different tool rake angles, and subsurface damage was characterized by cross-sectional transmission electron microscopy and laser micro-Raman spectroscopy. It was found that amorphization, poly-crystallization, dislocation and internal microcracking occurred and these material responses depended strongly on the cutting direction. When cutting in the [11¯0] and [01¯0] directions, deep line defects consisting of microcracks and dislocation groups occurred even when the surface was “ductile”-cut; while for the [128309¯0] direction, the damage depth was reduced by a factor of five.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: CIRP Annals - Volume 61, Issue 1, 2012, Pages 131-134
Journal: CIRP Annals - Volume 61, Issue 1, 2012, Pages 131-134
نویسندگان
Jiwang Yan, Tooru Asami, Hirofumi Harada, Tsunemoto Kuriyagawa,