Electrochemical micromachining of microstructures of micro hole and dimple array

This paper proposes a method of electrochemical micromachining of micro hole or dimple array, in which a patterned insulation plate coated with metal film as cathode is closely attached to workpiece plate. When voltage is applied across the workpiece and cathode film over which the electrolyte flows at high speed, hole or dimple array will be produced. The proposed technology offers unique advantages such as short lead time and low cost. The effect of process parameters on the microstructure shape was demonstrated numerically and experimentally. Arrays of holes or dimples of several hundred micrometers diameter have been produced.