Simulation of the local kinematics in rotational grinding

The rotational grinding process enables production of substrates for the semiconductor industry by a singular capacity to meet planarity and total thickness variation (TTV) requirements. However, the simple configuration is characterised by varying local kinematics. An upper-bound simulation of the meso-scale engagement kinematics has been developed with analysis algorithms that provide estimates of local kinematical parameters. These have been correlated with local measurements for typical brittle-mode microgrinding parameters including measurements of the local normal force. The results generally correlated for surface roughness but not for local normal force where 'equilibration' was attributed to system local and bending stiffness components.