کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
10674025 | 1010266 | 2011 | 4 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
A newly developed polishing pad for achieving high surface flatness without edge roll off
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موضوعات مرتبط
مهندسی و علوم پایه
سایر رشته های مهندسی
مهندسی صنعتی و تولید
پیش نمایش صفحه اول مقاله
چکیده انگلیسی
Demand for diminishing edge roll off while polishing surfaces such as those of silicon wafers and glass disks has currently exceeded the capabilities of existing technologies. To address this problem, the influence of polishing pad properties on the stress distribution near the workpiece edge was investigated using finite element methods. Based on the results, double-layered polishing pads having an extra-fine fiber thin layer and a hard polymer layer were developed. Polishing experiments on silicon wafers and glass plates showed that the developed polishing pads achieved high finishing efficiency and improved surface flatness near the edge.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: CIRP Annals - Volume 60, Issue 1, 2011, Pages 371-374
Journal: CIRP Annals - Volume 60, Issue 1, 2011, Pages 371-374
نویسندگان
T. Enomoto, U. Satake, T. Miyake, N. Tabata,