Development of Specific Technologies and Assembly Systems for the New Challenge of Electro-Optical Devices

Today's information and communication systems are especially characterized by their capability and reliability of high data rate transmission. An integration of optical wave guides into printed circuit boards allows a hybrid electronics packaging in order to increase the data transmission rate. The success of this technology depends in particular on the availability of efficient production solutions. For this reason, the development of automated assembly systems for electro-optical components has become a main research field at the Institute for Manufacturing Automation and Production Systems. This paper describes the challenges of the placement systems and presents a continuous process chain for the automated assembly of electro-optical components.