Electrical modeling of ball grid array packages based on one-port S-parameter measurement for electrical evaluation of high-speed test board

To electrically characterize ball grid array (BGA) packages, one-port S-parameter measurements have been performed. Equivalent circuit parameters using the Γ and T models are extracted from measured S-parameters for three different frequency ranges. The accuracy of two selected equivalent circuits is evaluated by comparison between the re-calculated S11 using the extracted equivalent circuit parameters and measured S-parameters. The results show that the T lumped model can be used to represent S-parameters of BGA packages without distributed elements up to 2 GHz.