Self-assembly of reduced Au atoms for vertical interconnections in three dimensional integrated circuits

Self-assembly of reduced Au atoms for vertical interconnections in three dimensional integrated circuits

Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Scripta Materialia - Volume 159, 15 January 2019, Pages 119-122

I.A. Weng, H.T. Hung, S. Yang, C.R. Kao, Y.H. Chen,