Epoxy resin in organic WORM memories: From capsuling to the active layer

• We produced organic WORM memories where the active layer is composed of an epoxy resin-carbon spheres nanocomposite.
• ION/IOFF ∼ 105; recording time is as short as 100 ns; Projected reading time: 20 ns; low recording voltage (2.5 V).
• The memories are thermally and electrically stable with the time. Processing yield was maximum in a set of 20 test samples.
• “All With One” (AW1) technique: the organic constituents of the device based on a single main material.

The production of organic memory devices comprises the preparation of the substrate, deposition of the active layer and the electrodes, and the final capsuling. Owing to the low cost and robustness of the epoxy resin – a typical encapsulant – compared to other polymers employed on the active layer, we propose the development epoxy based memories. We successfully produced epoxy resin/carbon spheres nanocomposite-based organic WORM memories with an ION/IOFF ratio of the order of 105, low recording voltages of 2.5 V, and thermally and electrically stable during a test period of 30 days. For the concentration 0.4 wt% and the film thickness 1.3 μm a short 100 ns electric pulse was sufficient for the recording, which is lower than the average minimum of 200 ns reported in the literature. Both the high ION/IOFF ratio and the short recording time we attribute to a fast and efficient mechanism of formation of conducting filaments inside the nanocomposite, due to the action of the external applied electrical field. These results point to the possibility of the development of a “All With One” (AW1) technique, where the overall device is based on a single main material – from the substrate and the active layer to the capsuling.

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