Electroless Ni-plating on PTFE fine particles

A Ni electroless plating process was used with polytetrafluoroethylene (PTFE) fine particles (25–500 μm). Using nonionic hydrocarbon surfactant, PTFE particles were dispersed in the plating bath. The PTFE hydrophobicity was sufficiently high that Ni was deposited partly on the PTFE surface in the initial step. The Ni-PTFE particles were formed into the Ni-PTFE plate by heat treatment at 350 °C after pressing. The Ni-PTFE plate had electrical conductivity and gas permeability, which were influenced by the pore distribution in the plate. Pores with 1 μm diameter might be especially important to impart high gas permeability to the Ni-PTFE plate.

Relationship between the contact angle of a water droplet on surfactant-treated PTFE and HLB of the surfactant: 1, BL-2; 2, BL-4.2; 3, BL-9EX; 4, BC-2; 5, BC-5.5; 6, BS-2; 7, BS-4; 8, BO-2V; 9, BO-7V. The dashed line at 109° shows to the blank (without surfactant) sample.Figure optionsDownload as PowerPoint slide