Effect of interface debonding on the thermal conductivity of microencapsulated-paraffin filled epoxy matrix composites

Microcapsules containing phase change materials (microPCMs) can be filled in polymeric matrix forming smart temperature-controlling composites. The aim of this study was to investigate the effect of interface debonding on the thermal conductivity of microPCMs containing paraffin/epoxy composites. The shell thickness and average size of microPCMs were controlled by regulating the core/shell ratios and emulsion stirring rates. Test results indicated that the thermal conductivity (Ke) of all composites decreased after a thermal shock treatment. SEM and thermography measurements were applied to observe the interface behaviors of composites after a violent thermal treatment process. It was proved that the interface debonding was generated because of the mismatch of expansion coefficient between shell and epoxy. A modeling analysis of the relative thermal conductivity (Kr) indicated that the effective approach to decrease the debonding is to enhance the molecule tangling degree between shell and matrix.