کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
1498196 | 1510894 | 2015 | 5 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
A comparative study of Cn/Sn/Cu and Ni/Sn/Ni solder joints for low temperature stable transient liquid phase bonding
دانلود مقاله + سفارش ترجمه
دانلود مقاله ISI انگلیسی
رایگان برای ایرانیان
کلمات کلیدی
موضوعات مرتبط
مهندسی و علوم پایه
مهندسی مواد
سرامیک و کامپوزیت
پیش نمایش صفحه اول مقاله
![عکس صفحه اول مقاله: A comparative study of Cn/Sn/Cu and Ni/Sn/Ni solder joints for low temperature stable transient liquid phase bonding A comparative study of Cn/Sn/Cu and Ni/Sn/Ni solder joints for low temperature stable transient liquid phase bonding](/preview/png/1498196.png)
چکیده انگلیسی
Two sandwich structured solder systems (Cu/Sn/Cu and Ni/Sn/Ni) were investigated in terms of interfacial reaction and mechanical reliability for low temperature wafer bonding. The relationship between chemical reaction and mechanical reliability of the solder joints was investigated by varying thickness ratio of Cu/Sn (Ni/Sn). The Cu/Sn/Cu joint was proved to be stronger, revealing very smooth fractured surface through Cu6Sn5 grains (intragranular fracture). Meanwhile, the Ni/Sn/Ni joint showed rough fractured surface through Ni3Sn4 grain boundaries and Ni3Sn4/Ni3Sn2 interphase boundaries (intergranular fracture).
Figure optionsDownload high-quality image (183 K)Download as PowerPoint slide
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Scripta Materialia - Volume 109, December 2015, Pages 113–117
Journal: Scripta Materialia - Volume 109, December 2015, Pages 113–117
نویسندگان
Kunmo Chu, Yoonchul Sohn, Changyoul Moon,