کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
1498821 | 993280 | 2013 | 4 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
Anisotropic dissolution behavior of the second phase in SnCu solder alloys under current stress
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کلمات کلیدی
موضوعات مرتبط
مهندسی و علوم پایه
مهندسی مواد
سرامیک و کامپوزیت
پیش نمایش صفحه اول مقاله
![عکس صفحه اول مقاله: Anisotropic dissolution behavior of the second phase in SnCu solder alloys under current stress Anisotropic dissolution behavior of the second phase in SnCu solder alloys under current stress](/preview/png/1498821.png)
چکیده انگلیسی
The microstructural evolution of the intermetallic compound (Cu6Sn5) in Sn–xCu solder matrix under current stress was investigated by scanning electron microscopy (SEM) and in situ synchrotron X-ray diffraction (XRD). The phase evolution of the Cu6Sn5 was also investigated under thermal aging for comparison. The only XRD crystalline peak (3¯14) of Cu6Sn5 that was detected disappeared under current stress, but not under thermal aging. Ex situ SEM observation of the Cu6Sn5 crystal revealed an anisotropic dissolution behavior. The kinetics of the anisotropic dissolution was also investigated.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Scripta Materialia - Volume 68, Issue 5, March 2013, Pages 317–320
Journal: Scripta Materialia - Volume 68, Issue 5, March 2013, Pages 317–320
نویسندگان
Wei-Yu Chen, Tsung-Chieh Chiu, Kwang-Lung Lin, Albert T. Wu, Wei-Luen Jang, Chung-Li Dong, Hsin-Yi Lee,