کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
1499520 | 993310 | 2012 | 4 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
Embrittlement study of electroplated nickel films by microindentation
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موضوعات مرتبط
مهندسی و علوم پایه
مهندسی مواد
سرامیک و کامپوزیت
پیش نمایش صفحه اول مقاله
چکیده انگلیسی
Electroplated nickel is known to suffer from a brittle fracture problem. This phenomenon originates from small amounts of impurities such as hydrogen, sulfur and phosphorus which are incorporated during the plating process and improve the mechanical properties (hardness) through grain refinement. In this study, the correlation between the impurities and brittle fracture of electroplated Ni films was systematically investigated via microindentation in the temperature range 673–973 K. The measured KC values ranged between 2.6 and 3.2, and the activation energy for the grain growth was determined to be 234 kJ mol−1.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Scripta Materialia - Volume 67, Issue 11, December 2012, Pages 919–922
Journal: Scripta Materialia - Volume 67, Issue 11, December 2012, Pages 919–922
نویسندگان
Yoonchul Sohn, Minjong Bae, Inyong Song, Kunmo Chu, Dongun Kim, Intaek Han,