کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
1500024 | 993330 | 2012 | 4 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
Formation behavior of different topographies of crack growth path under high and low cyclic stresses in ultrafine-grained copper
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کلمات کلیدی
موضوعات مرتبط
مهندسی و علوم پایه
مهندسی مواد
سرامیک و کامپوزیت
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چکیده انگلیسی
Fatigue tests of ultrafine-grained copper specimens were conducted. The crack growth direction under constant stress depended on the magnitude of the stress amplitude. It occurred perpendicular to the loading axis at low stresses and was inclined at 45° to the loading axis at high stress. To clarify the different growth mechanisms between the high- and low-stress amplitudes, two-step fatigue stress tests were conducted. The crack path formation under high- and low-stress amplitude is discussed from the viewpoint of the evolution of damaged areas around the crack.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Scripta Materialia - Volume 66, Issue 6, March 2012, Pages 355–358
Journal: Scripta Materialia - Volume 66, Issue 6, March 2012, Pages 355–358
نویسندگان
M. Goto, K. Kamil, S.Z. Han, K. Euh, Y. Yokoho, S.S. Kim,