Copper–rubber interface delamination in stretchable electronics

Interface delamination in metal–rubber-type stretchable electronic systems leads to early failure. This paper reports an investigation of metal–rubber interfaces through in situ scanning electron microscopy imaging of the progressing delamination front of 90° peel tests of rubber on copper samples. The results show that the energy dissipated in the forming, elongation and rupture of ∼50 μm long fibrils constitutes the major part of the work of separation. The experiments are characterized and modeled using a cohesive zone-enriched finite-element model.