Changes in the grain boundaries of a nanolamellar structured Co–Cu alloy by annealing

Changes in the microstructures of a nanolamellar structured Co–Cu alloy brought about by annealing were analyzed with a transmission electron microscope (TEM). TEM images revealed that the Co–Cu alloy annealed at 973 K has coherent boundaries with hexagonal close-packed/face-centered cubic (fcc) or fcc/fcc structures with less stacking disorder than the as-deposited alloy. It is therefore suggested that the microstructural changes affect the mechanical properties of the Co–Cu alloy.